Products
Precision Equipment for the Angstrom Era
From atomic layer etching to gas delivery and plasma sources — integrated solutions for next-generation semiconductor manufacturing.
Atomic Layer Etching Tool
Bridging atomic precision with production throughput
Our flagship ALE platform delivers self-limiting etch chemistry for the most demanding semiconductor manufacturing processes. Supports thermal ALE, plasma ALE, and cryogenic ALE modes in a single, production-ready system.
- Self-limiting etch per cycle: 0.3-1.0 nm/cycle
- Thermal, plasma, and cryogenic ALE modes
- Aspect ratios >100:1 with <0.1% CD variation
- Multi-material capability (Si, SiO₂, SiN, HfO₂, metals, III-Vs)
- Hybrid ALE/RIE mode for production throughput
- AI-assisted digital twin for process optimization
- Compatible with 200mm and 300mm wafers
Gas Delivery System
Ultra-high-purity gas delivery for atomic-scale processes
Precision gas delivery engineered for ALE, ALD, CVD, and advanced etch processes. Sub-millisecond valve switching ensures sharp transitions between ALE half-cycles, critical for self-limiting chemistry.
- Sub-millisecond gas switching (<0.5 ms)
- Multi-zone temperature control (ambient to 200°C)
- Compatible with corrosive and pyrophoric gases
- 12+ independent gas lines per module
- Fast-switching piezo and pneumatic valves
- Integrated mass flow controllers (MFC) with ±0.5% accuracy
- Modular design for easy line reconfiguration
Plasma-in-Liquid Coating
Novel coating technology for advanced materials
Innovative plasma-in-liquid technology for nanoparticle synthesis, surface functionalization, and thin-film deposition on complex 3D structures. Enables uniform coatings on substrates that are difficult to process with conventional vacuum techniques.
- Nanoparticle synthesis and surface functionalization
- Uniform coating on complex 3D geometries
- Room-temperature processing capability
- Compatible with diverse substrate materials
- Scalable from R&D to production volumes
- Applications: batteries, catalysts, biomedical